New findings from the IBM (NYSE: IBM) Institute for Business Value revealed that banking and financial markets (BFM) CEOs are facing workforce and culture and challenges as they act quickly to implement and scale generative AI across their organizations.
Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM (NYSE: IBM), today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with a goal of further innovating in this space.
Industry players like IBM, HPE, AGYS and PAR are gaining from the increased demand for integrated solutions and the growing adoption of the multi-cloud model, despite persistent supply chain constraints.