BE Semiconductor Industries N.V. (BSI.F)
BE Semiconductor Industries N.V.
Ratio 6
Duiven 6921 RW
Netherlands
31 26 319 4500
https://www.besi.com
Sector(s): Technology
Industry: Semiconductor Equipment & Materials
Full-time employees: 1,760
Description
BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
Corporate governance
BE Semiconductor Industries N.V.’s ISS governance QualityScore as of 1 June 2024 is 1. The pillar scores are Audit: 6; Board: 2; Shareholder rights: 5; Compensation: 2.
