Taiwan Semiconductor Manufacturing Company Limited (TSM)
| Previous close | 86.24 |
| Open | 84.95 |
| Bid | 84.53 x 1200 |
| Ask | 84.54 x 800 |
| Day's range | 84.36 - 85.22 |
| 52-week range | 59.43 - 110.69 |
| Volume | |
| Avg. volume | 8,870,841 |
| Market cap | 438.641B |
| Beta (5Y monthly) | 1.19 |
| PE ratio (TTM) | 14.92 |
| EPS (TTM) | 5.67 |
| Earnings date | N/A |
| Forward dividend & yield | 1.83 (2.14%) |
| Ex-dividend date | 14 Dec 2023 |
| 1y target est | 111.52 |
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TSMC boosts CoWoS packaging machine orders by 30% amid surging AI chip demand
The Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly increased its orders for machines needed for Chip on Wafer on Substrate (CoWoS) packaging by 30% to keep up with the rising demand for artificial intelligence (AI) chips, according to a report from Taiwan Economic Daily on Tuesday. The company's clients, including Amazon (NASDAQ:AMZN), AMD, Broadcom (NASDAQ:AVGO), and Nvidia (NASDAQ:NVDA), are placing rush orders for AI chips to meet the growing usage of Generative AI models su
