Australia markets closed

Samsung Electronics Co., Ltd. (SSNLF)

Other OTC - Other OTC Delayed price. Currency in USD
Add to watchlist
40.600.00 (0.00%)
At close: 03:18PM EDT
Full screen
Trade prices are not sourced from all markets
Previous close40.60
Open40.60
BidN/A x N/A
AskN/A x N/A
Day's range40.60 - 40.60
52-week range40.60 - 40.60
Volume200
Avg. volume0
Market cap301.846B
Beta (5Y monthly)0.84
PE ratio (TTM)8.44
EPS (TTM)N/A
Earnings dateN/A
Forward dividend & yieldN/A (N/A)
Ex-dividend date27 Dec 2023
1y target estN/A
  • PR Newswire

    /C O R R E C T I O N -- SEMIFIVE/

    SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea. This marks SEMIFIVE's third commercialization of its SoC Platform solutions built on Samsung Foundry's mass production proven FinFET process technologies.

  • PR Newswire

    DEEPX at MWC 2024: Advances Ultra-Low-Power On-Device AI Chip for Commercializing Generative AI

    DEEPX (CEO Lokwon, Kim), a frontrunner in AI chip technology, defines the critical technology for commercializing generative AI as the 'Federated Operation of LLM' and is advancing in its technology development. DEEPX is set to revolutionize on-device AI with its cutting-edge ultra-low-power AI chips and making a significant presence at the Mobile World Congress (MWC) 2024, held from February 26 to 29, where it will unveil a comprehensive blueprint for on-device AI and plans to expand partnershi

  • PR Newswire

    DEEPX Unveils 'All-in-4 AI Total Solution' at CES 2024: Four AI Chips Transforming On-Device AI Market

    DEEPX (CEO, Lokwon Kim), an original AI chip technology company, is set to enter the global AI chip race at CES 2024 with its comprehensive All-in-4 AI Total Solution, consisting of four chips for on-device AI such as physical security systems, machine vision, smart mobility, robot platforms, and AI servers.