ASE Technology Holding Co., Ltd. (2DQ.F)
| Previous close | 9.85 |
| Open | 9.60 |
| Bid | 9.35 x N/A |
| Ask | 9.55 x N/A |
| Day's range | 9.60 - 9.60 |
| 52-week range | 5.85 - 10.80 |
| Volume | |
| Avg. volume | 85 |
| Market cap | 20.732B |
| Beta (5Y monthly) | 1.09 |
| PE ratio (TTM) | 20.43 |
| EPS (TTM) | 0.47 |
| Earnings date | N/A |
| Forward dividend & yield | 0.51 (5.22%) |
| Ex-dividend date | 30 June 2023 |
| 1y target est | 6.22 |
PR NewswireASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*
ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its unaudited consolidated net revenues for March and 1st quarter of 2024.
PR NewswireASE TECHNOLOGY HOLDING CO., LTD. Files 2023 Annual Report On Form 20-F
ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces that it has filed its annual report on Form 20-F for the year ended December 31, 2023 with the U.S. Securities and Exchange Commission. The 2023 20-F is available on ASEH's website at www.aseglobal.com and on the website of the U.S. Securities and Exchange Commission at www.sec.gov. Hard copies of the audited financial statements included in the 2023 Form 20-F are available to shareholders upon request
Business WireASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets
SUNNYVALE, Calif., March 20, 2024--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its advanced interconnect technology under the VIPack™ platform to meet the accelerating demand for complex chiplet integration for artificial intelligence (AI) applications. This interconnect extension advances roadmap capabilities from a chip-on-wafer interconnect pitch of 40um to 20um through advanced mi
