Previous close | 171,600.00 |
Open | 0.00 |
Bid | 0.00 x 0 |
Ask | 0.00 x 0 |
Day's range | 0.00 - 0.00 |
52-week range | |
Volume | |
Avg. volume | 4,257,019 |
Market cap | 117.753T |
Beta (5Y monthly) | 0.90 |
PE ratio (TTM) | N/A |
EPS (TTM) | N/A |
Earnings date | N/A |
Forward dividend & yield | 1,200.00 (0.70%) |
Ex-dividend date | 27 Dec 2023 |
1y target est | N/A |
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced from 2026, through this initiative.
SK hynix Inc. (or "the company", www.skhynix.com), the world's leading producer of High-Bandwidth Memory (HBM) chips, announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products. The project, the first of its kind in the United States, is expected to drive innovation in the nation's AI supply chain, while bringing more than a thousand new jobs to the region.
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has begun volume production of HBM3E*, the newest AI memory product with ultra-high performance, for supply to a customer from late March. The company made public its success with the HBM3E development just seven months ago.