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Micron flags hit to its DRAM supply from Taiwan earthquake

(Reuters) - Memory chipmaker Micron Technology said on Thursday the April 3 earthquake in Taiwan would hurt a calendar quarter of its dynamic random access memory (DRAM) supply by up to a mid-single digit percentage.

The company is present in four locations in Taiwan, which plays an outsized role in the global chip supply chain and the earthquake had raised concerns of a potential disruption.

Micron said it was not yet at full DRAM production following the earthquake, but added there would be no impact to its long-term DRAM supply capability.

DRAM is used extensively in data centers, personal computers, smartphones and other computing devices.

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Investors have driven a rally in Micron's stock as demand sky-rockets for its chips from the booming AI industry.

Micron said in February it had started mass production of its high-bandwidth memory (HBM) chips for use in Nvidia's H200 graphics processing units used in AI applications.

SHANGHAI, CHINA - NOVEMBER 7, 2023 - Visitors view semiconducter-related chips at the booth of Micron at the 6th CIIE in Shanghai, China, November 7, 2023. (Photo by Costfoto/NurPhoto via Getty Images)
The Micron booth at the 6th CIIE in Shanghai in November. (Costfoto/NurPhoto via Getty Images) (NurPhoto via Getty Images)

The company's HBM chips, which are used in the development of AI applications, were sold out for 2024 and a majority of 2025 supply had already been allocated, CEO Sanjay Mehrotra said in March.

Micron has previously described HBM chips as a stacked DRAM technology. The company did not specify whether its HBM supplies will be hampered by the earthquake.

(Reporting by Arsheeya Bajwa in Bengaluru; Editing by Sriraj Kalluvila)